MediaTek has introduced its latest flagship smartphone chipset, the Dimensity 9600 Pro, with a focus on on-device agentic AI, stronger performance and improved power efficiency. The SoC is built using TSMC’s advanced 2nm process and features a dual-NPU architecture.
The chipset includes an Agentic AI Engine that can process on-device AI models with up to 30 billion parameters. MediaTek says it can also reduce power consumption for always-on AI tasks by 40 per cent.
“AI is central to the smartphone experience, and devices need greater performance, efficiency, and intelligence to keep pace with rapidly evolving user demands,” said JC Hsu, corporate senior vice president at MediaTek and general manager of the wireless communications business unit.
Hsu said the Dimensity 9600 Pro uses a Native AI architecture to support scalable agentic AI experiences.
The SoC uses an All Big Core CPU design with 2 C2-Ultra cores clocked at up to 4.55GHz, 3 C2-Pro cores at 4.35GHz and 3 C2-Pro cores at 3.1GHz. Compared with the previous generation, it delivers up to 17 per cent higher single-core performance, 15 per cent higher multi-core performance and a 61 per cent reduction in multi-core power consumption.
The chipset has a 34.5MB cache, LPDDR6 memory support and UFS 5.0 storage. An upgraded Dimensity Scheduling Engine manages hardware resources.
For graphics, the G2-Ultra NX GPU offers up to 27 per cent higher peak performance, 24 per cent lower power consumption and 18 per cent faster ray tracing. It supports mobile gaming at up to 185fps.
Imaging is handled by the Imagiq 1290 ISP and AI Imaging Fusion Architecture. The system supports NPU-powered 60fps motion capture and 4K240 native ultra-slow-motion video.
MediaTek has also introduced the Dimensity 9600M, featuring the Agentic AI Engine, HyperEngine gaming optimisation and a dedicated ISP to bring flagship features to broader market segments.
The first smartphones powered by the Dimensity 9600 Pro and Dimensity 9600M are expected to launch during the current quarter.
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