In a major step to expand its global manufacturing footprint, TSMC has announced plans to introduce its advanced 3-nanometer chip technology in Japan.
The company’s second plant in the country is expected to be operational by 2028 and will produce around 15,000 high-tech wafers every month. The announcement was made by CEO CC Wei during a meeting with Fumio Kishida.
As part of its expansion strategy, TSMC is investing over $20B in its Japanese operations. The company’s first facility in Japan had already begun chip production in late 2024, focusing on older-generation technology. In contrast, the upcoming plant will handle its most advanced chip manufacturing processes.
TSMC’s Japan unit is supported by major industry players, including Sony, DENSO, and Toyota. These partnerships are expected to strengthen the country’s semiconductor ecosystem.
With this move, TSMC is positioning Japan as a key hub for next-generation chip production while meeting rising global demand for advanced semiconductors.
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