India’s semiconductor manufacturing ambitions received another major push after the Government of Odisha signed an MoU with Intel and 3DGS to introduce substrate manufacturing technology in the country. The announcement was shared by Union Electronics and Information Technology Minister Ashwini Vaishnaw on Friday.
Highlighting the development, Vaishnaw said, “Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India.”
The partnership is aimed at boosting India’s domestic semiconductor ecosystem and strengthening the country’s electronics supply chain. Substrate manufacturing plays an important role in semiconductor production, as substrates are used to support and connect semiconductor chips inside electronic devices.
The latest agreement comes shortly after the Union Cabinet approved 2 semiconductor projects under the India Semiconductor Mission. These include India’s first commercial Mini/Micro-LED display facility based on Gallium Nitride technology and a semiconductor packaging unit in Gujarat.
The 2 projects together involve investments of nearly ₹3,936 crore and are expected to create jobs for 2,230 skilled professionals.
The MoU also supports the Centre’s long-term semiconductor roadmap. Earlier this year, Vaishnaw stated that 4 semiconductor plants are expected to be ready in India by 2026, while 2 additional plants are planned for 2027. He also mentioned that India’s first fabrication unit in Dholera is likely to begin operations by 2028.
The government has been focusing on building a complete semiconductor ecosystem that includes manufacturing machinery, specialty chemicals, industrial gases, and testing infrastructure.
“Our approach is design in India and make in India,” Vaishnaw had said earlier while outlining India’s semiconductor vision.
The government aims to position India among the top 6 semiconductor nations by 2032 and among the top 3 globally by 2047 as the country continues to attract investments and technology partnerships in the chip manufacturing sector.
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