Google’s latest flagship chip has taken a different path from earlier reports about its manufacturing process. The Tensor G6, which powers the new Pixel 11 series, is reportedly built using TSMC’s enhanced 3nm technology rather than the 2nm process that had been rumoured earlier.
Tensor G6 built on 3nm technology
At the Made by Google event earlier this week, Google unveiled the Pixel 11 series along with other ecosystem products. The new smartphones are powered by the Tensor G6, which brings improved on-device AI capabilities and a more powerful TPU.
According to a report citing Google Vice President of Hardware Peng Yu-chun, the Tensor G6 is fabricated using TSMC’s latest enhanced 3nm process. The chip powers the Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL and Pixel 11 Pro Fold.
The confirmation goes against earlier reports that Google would be the first smartphone maker to use TSMC’s 2nm process, potentially getting ahead of Apple. The iPhone maker has historically been among TSMC’s first major customers for new chipmaking nodes. Google was previously rumoured to move ahead with the Tensor G6.
The Tensor G6 still brings several hardware improvements. Google says it delivers up to 25% faster web browsing and 15% faster app launches. Its TPU offers 50% more compute and supports a new version of Gemini Nano for on-device AI tasks.
The chip also features an upgraded Image Signal Processor (ISP), designed to improve Night Sight processing speed and digital zoom performance on the Pixel 11 series.
Had Google used TSMC’s 2nm process, it would have been the 2nd smartphone maker to adopt the technology. Samsung was the first with its Exynos 2600 SoC, introduced in December as the world’s first 2nm chip using advanced GAA technology.
The Exynos 2600 powers the Samsung Galaxy S26 series and Galaxy Z Flip 8. It combines the CPU, GPU and NPU in a single chip for improved AI and gaming performance.
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