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MediaTek launches Dimensity 9500: Next-generation 5G chip with advanced AI and gaming power

MediaTek has unveiled its latest flagship mobile platform, the Dimensity 9500, setting new benchmarks in AI performance, gaming, and energy efficiency for 5G smartphones.

The Dimensity 9500 features a third-generation All Big Core CPU design with a 4.21GHz ultra core, three premium cores, and four performance cores, paired with four-lane UFS 4.1 storage. This architecture delivers up to 32 percent higher single-core and 17 percent higher multi-core performance than the previous generation while reducing peak power consumption by 55 percent for longer battery life. The chip is also 30 percent more power efficient during multitasking in games and social audio apps.

The new memory and cache design, including support for 4-channel UFS4.1, doubles read/write speeds and accelerates large AI model loading by 40 percent. The second-generation Dimensity Scheduling Engine ensures smooth performance and sustained efficiency under heavy workloads.

Powered by the Arm G1-Ultra GPU, the Dimensity 9500 provides up to 33 percent higher peak graphics performance and 42 percent improved power efficiency. It supports frame rate interpolation up to 120FPS and AAA-level real-time rendering with Unreal Engine 5.5 and 5.6, delivering console-quality gaming experiences.

The chip integrates the ninth-generation MediaTek NPU 990 with Generative AI Engine 2.0, doubling AI compute power and introducing BitNet 1.58-bit large model processing while reducing power use by 33 percent. Users benefit from faster large language model output, 128K token text processing, and 4K ultra-high-definition image generation with up to 56 percent lower peak power consumption.

The Dimensity 9500 also features the MediaTek Imagiq 1190 for RAW-domain pre-processing, up to 200MP capture, continuous focus tracking, and cinematic 4K 60FPS portrait video. MiraVision Adaptive Display technology ensures clear viewing in all lighting conditions while protecting the eyes.

Its connectivity suite includes AI-powered call enhancements, Wi-Fi fast transfer, multi-network intelligence, 5CC carrier aggregation for 15 percent higher bandwidth, and AI-based positioning and network selection for lower latency.

Flagship smartphones featuring the MediaTek Dimensity 9500 are expected to launch in the fourth quarter of 2025, promising a new era of AI, gaming, and efficiency for mobile users.

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