Samsung Electronics has begun shipping its latest high bandwidth memory chips, HBM4, to undisclosed customers as it works to narrow the gap with rivals supplying Nvidia. The move comes as global demand for AI data centres continues to surge, increasing the need for advanced memory solutions that can handle complex artificial intelligence workloads.
The rapid expansion of AI infrastructure has driven strong demand for HBM, a type of dynamic random access memory designed to process massive volumes of data generated by AI applications. Samsung, the world’s largest memory chipmaker, had been slower than competitors in responding to the advanced AI chip segment and trailed rivals in supplying earlier generation HBM products.
Samsung said its HBM4 delivers a consistent processing speed of 11.7 gigabits per second, marking a 22% improvement over its predecessor HBM3E. The company added that the new chips can reach a maximum speed of 13 gigabits per second, helping reduce growing data bottlenecks in AI systems. Samsung also plans to provide samples of its next generation HBM4E chips in the second half of this year. Following the announcement, Samsung shares closed 6.4% higher on Thursday.
Competition in the HBM market remains intense. SK Hynix said in January that it aims to maintain its “overwhelming” market share in next generation HBM4 chips, which are already in volume production, as rivalry with Samsung increases. The company also stated it intends to achieve production yields for HBM4 similar to those of its current HBM3E chips. Meanwhile, Micron’s CFO confirmed that the company is in high volume production of HBM4 and has started shipping the chips to customers, adding further pressure in the race to dominate AI memory technology.
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