Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions’ upcoming semiconductor plant, a senior state government official has confirmed.
According to Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev, the ground-breaking ceremony for SicSem, a silicon carbide company, will take place next month. Commercial chip production from the unit is expected to begin within two years.
“Chief Minister Mohan Charan Majhi was here, and they (SiCSem and 3DGS) have given a commitment to start the unit soon. SiCSem’s ground-breaking will be done next month, and the other company, 3D Glass Solutions (3DGS), they are looking for a date from Intel CEO Lip-Bu Tan. He plans to visit Odisha also. That is when the ground-breaking will happen. Hopefully, in the next two to three months,” Dev said.
The 3D Glass semiconductor packaging unit will be set up by Heterogeneous Integration Packaging Solutions Pvt Ltd, supported by major US technology players such as Intel, Lockheed Martin, and Applied Materials. The project involves an investment of Rs 1,943 crore and will have an annual production capacity of five crore units. This marks the first semiconductor project in India that involves Intel Corporation alongside other global technology partners.
SicSem Private is partnering with UK-based Clas-SiC Wafer Fab to establish the country’s first integrated silicon carbide-based compound semiconductor fabrication facility at InfoValley in Bhubaneswar.
Dev also mentioned that RIR Power Electronics has updated the Chief Minister on its Rs 618 crore silicon carbide wafer fabrication facility, which is already operational and aims to begin commercial production by March 2026.
The Odisha government has introduced a revised semiconductor policy to attract investments and talent. The policy offers incentives equal to 50 percent of those provided by the central government, along with additional benefits. Engineering students are being offered incentives of around Rs 10,000 if they choose semiconductor as a subject, along with support to develop and commercially launch their own chips.
In an official note, Odisha government announced that it has signed two major agreements for electronics manufacturing projects worth Rs 2,655 crore.
“Two significant MoUs were signed on Day 1 (September 2) between the Government of Odisha and leading global companies TopTrack Hi-Tech PCB, for a Rs 1,005 crore advanced PCB manufacturing facility, and Sancode Technologies Limited, which is leveraging the expertise of its technology partners Silicon Connect, Advanced Packaging Institute and Research Center (APIRC), and Inari Amertron Berhad to set up a Rs 1,650 crore facility,” the statement said.
These projects are expected to strengthen Odisha’s position in India’s growing semiconductor and electronics ecosystem.
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