Ahead of a major global tech gathering, MediaTek has announced plans to showcase a new range of AI and connectivity technologies at its “AI For Life: From Edge to Cloud” event during Mobile World Congress 2026. The keynote, led by President Joe Chen, is scheduled for March 4.
The company and its partners will present updates in 6G research, 5G-Advanced CPE with Wi-Fi 8, automotive connectivity, flagship smartphone AI, and data centre infrastructure.
6G research and AI-driven connectivity
MediaTek claims it will demonstrate the world’s first 6G radio interoperability. The technology is designed to balance throughput, latency, and power optimisation, while supporting generative and agentic AI services. The showcase will also highlight 6G and edge computing for next-generation robotics requiring responsive and compute-intensive processing.
The company will also present its “personal device cloud” concept, where AI agents work together across personal or family devices via Wi-Fi or 6G in a secure environment. In addition, its “AI-accelerated uplink transmit diversity (Txd) for 6G” will show dynamic performance adjustments compared to rule-based systems.
5G-Advanced CPE and automotive AI
MediaTek plans to introduce what it calls the world’s first 5G-Advanced CPE device with Wi-Fi 8, powered by the MediaTek T930 and Filogic 8000 chipsets. The device supports 3GPP Release 18 standards and features 8 receive antennas, improving spectrum efficiency by more than 40%.
It also includes 3 transmit antennas supporting 5 MIMO layers, boosting uplink throughput by up to 40%. The new AI network engine integrating AI L4S and AI QoS technologies is said to deliver up to 10x lower latency from the CPE edge.
In automotive connectivity, MediaTek will showcase what it claims is the world’s first 5G NR NTN video call. A new telematics chipset supporting 5G-Advanced Release 17 and 18 with modem-level AI will also be introduced.
AI glasses and data centre solutions
On March 4, MediaTek will unveil a Dimensity Auto smart cockpit platform built on a 3nm automotive-grade process. It features Arm v9.2 CPU cores, advanced GPU with ray tracing, and an NPU for generative AI voice assistants with data privacy.
The company will also present AI glasses powered by the Dimensity 9500 for on-device multimodal AI interactions.
For data centres, MediaTek will introduce its UCIe-Advanced IP solution, silicon-validated for TSMC’s 2nm and 3nm processes, offering bandwidth up to 10 Tb/s/mm edge. A co-packaged optics solution delivering speeds up to 400 Gbps per fibre will also be announced.
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