Fresh reports suggest Apple is working on more than 1 foldable iPhone, signalling a broader push into new form factors. While the company is expected to debut its first foldable device in 2026, it may later introduce a smaller clamshell-style model, widely referred to as the iPhone Flip.
According to a seasoned journalist writing in the latest edition of the Power On newsletter for a global publication, Apple is exploring a compact foldable iPhone that could arrive after the launch of the iPhone Fold. The first foldable model is tipped to debut in the second half of 2026, marking Apple’s formal entry into the foldable smartphone segment.
The reported iPhone Flip is said to feature a square, clamshell-style design, similar to existing flip-style smartphones such as the Motorola Razr 60 Ultra and the Samsung Galaxy Z Flip 7. While Apple has not officially confirmed plans for such a device, the clamshell model is expected to follow the iPhone Fold, if it moves forward. However, its development is described as “far from guaranteed”.
The report notes that Apple is expecting strong demand for its first foldable iPhone. This could encourage interest in foldable iPhones across multiple sizes and designs, similar to how consumers currently choose between different iPhone display sizes.
In addition to the iPhone Flip, Apple is also reportedly considering another book-style foldable iPhone that would be larger than the iPhone Fold. Recent leaks suggest the first iPhone Fold could be smaller than its closest rival, the Galaxy Z Fold 7, and may feature a 5.5-inch outer display. A larger version could eventually sit above it in Apple’s product lineup.
Earlier reports indicate the iPhone Fold may focus heavily on hardware refinement. It is expected to have minimal creasing around the hinge area, an issue that affects many foldable devices. CAD renders suggest a flatter display surface with a less visible crease.
The iPhone Fold is also rumoured to include dual rear cameras and dual selfie cameras. It may be powered by the A20 Pro chipset built on 2nm process technology, with Apple’s C2 modem handling connectivity. For security, Touch ID could be integrated into the power button.
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