Tata Electronics has partnered with German engineering and technology giant Bosch to develop advanced chip packaging technologies.
The collaboration aims to enhance India’s capabilities in outsourced semiconductor assembly and test (OSAT) services, a critical segment of the global semiconductor value chain.
“This collaboration with Bosch underscores our shared vision to support India’s semiconductor ambitions,” said Randhir Thakur, CEO and MD of Tata Electronics. “Together, we aim to bring cutting-edge chip packaging and testing capabilities to India.”
The partnership is expected to bolster Tata Electronics’ upcoming OSAT facility in Hosur, Tamil Nadu. This facility, currently under development, will play a key role in supporting domestic and global demand for semiconductor components.
Bosch, which has been present in India for over 100 years, brings extensive experience in high-reliability semiconductor technologies. “Our collaboration with Tata Electronics reflects Bosch’s commitment to innovation and localization. We believe this partnership will accelerate the development of a robust semiconductor ecosystem in India,” said Guruprasad Mudlapur, President of Bosch India and MD of Bosch Limited.
Experts view this alliance as a strategic step that could help India reduce its reliance on imported semiconductor components, while also aligning with the government’s ‘Make in India’ and ‘Atmanirbhar Bharat’ initiatives.
The Tata-Bosch partnership signals growing momentum in India’s ambition to become a global hub for semiconductor design and manufacturing, and reflects a broader trend of global players betting on India’s high-tech future.
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