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Samsung to supply HBM4 memory for OpenAI’s next-gen AI chip

Samsung is set to become the exclusive supplier of HBM4 memory for OpenAI’s upcoming Titan AI chip, highlighting its growing role in the global AI hardware ecosystem.

According to reports, Samsung will provide up to 800 million Gb of 12-layer HBM4 memory in the second half of the year. This volume represents around 7% of the company’s total HBM output, estimated at 11 billion Gb annually, and about 15% of its HBM4 production capacity.

The HBM4 memory will power OpenAI’s first-generation Titan AI chip, which is being developed in collaboration with Broadcom. TSMC is expected to handle mass production of the chip starting in the third quarter, with a launch anticipated by the end of the year.

This deal positions Samsung as a key player in the AI supply chain, especially as demand for high-bandwidth memory continues to rise among AI chipmakers. It also marks a significant milestone for the company following challenges with its earlier HBM3e offerings.

The agreement is expected to generate billions in revenue for Samsung and signals strong confidence from OpenAI in the company’s advanced memory technology. It may also pave the way for continued collaboration on future AI chip developments.

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