As competition in advanced semiconductor technology intensifies, Samsung is reportedly working on secure basic silicon photonics technology and platforms by 2027. The company is expected to begin full-scale integration of this technology with AI semiconductors from 2028.
Silicon photonics is emerging as a key technology for next-generation AI hardware, and Samsung is moving quickly to reduce the gap with its main rival, TSMC, which continues to lead the global foundry market. Meanwhile, NVIDIA has already demonstrated a similar product in collaboration with TSMC last year.
Samsung plans to expand the capabilities of its silicon photonics technology further by 2029. The next phase will involve integrating this technology into advanced chip packaging that combines GPUs and high-bandwidth memory, aimed at powering future AI workloads.
The push reflects a broader industry shift, as leading semiconductor companies increasingly view silicon photonics as a core component for improving performance and efficiency in AI systems.
Samsung’s accelerated efforts are expected to play a crucial role in securing its position in the evolving AI hardware market over the coming years.
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