Intel CEO Lip Bu Tan is currently visiting India and met Prime Minister Narendra Modi in New Delhi earlier today. After the meeting he thanked the Prime Minister and praised India’s semiconductor policy. Sharing an update on X, he wrote, “Honored to meet Prime Minister @narendramodi in New Delhi this afternoon. We had a wide ranging discussion on a variety of topics related to technology, computing and the tremendous potential for India. I applaud the Prime Minister for putting in place a comprehensive semiconductor design and manufacturing policy and Intel is committed to support the India Semiconductor Mission.”
Intel’s growing partnership with Tata Group was also highlighted during the visit. The company recently signed an MoU with Tata Group to support manufacturing, assembly and packaging of Intel designed products at Tata Electronics upcoming Fab and OSAT facilities. The agreement also covers collaboration in advanced semiconductor packaging within India.
Tata Group is building a semiconductor manufacturing facility in Dholera in Gujarat and an assembly and packaging plant in Assam with a combined investment of Rs 1.18 lakh crore. Under this arrangement, Tata Electronics will manage manufacturing and packaging while Intel focuses on further localisation of its supply chain. This move aligns with India’s push to become a global semiconductor hub and meet fast growing demand.
Intel also plans to expand its AI powered PCs in the Indian market indicating the company’s long term view of India as a key part of its global technology strategy.
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