Huawei has, for the first time, disclosed details of its chipmaking progress and plans to expand its computing power capabilities, signalling ambitions to challenge Nvidia in the artificial intelligence sector.
The Chinese technology company announced it will introduce four new versions of its Ascend AI chip within the next three years. Following the launch of the Ascend 910C earlier this year, Huawei Vice Chairman Eric Xu said the company will release two versions of its successor, the Ascend 950, in 2026, followed by the Ascend 960 in 2027 and the Ascend 970 in 2028.
“Computing power has always been, and will continue to be, key to artificial intelligence, and even more so to China’s AI,” Xu told the annual Huawei Connect conference in Shanghai.
Xu revealed that the Ascend 950 will feature Huawei’s own high-bandwidth memory, addressing a longstanding technological bottleneck that had limited China to relying on suppliers from South Korea and the United States.
Alongside its chip roadmap, Huawei unveiled plans for new computing power supernodes, the Atlas 950 and Atlas 960. These systems will support 8,192 and 15,488 Ascend chips respectively, positioning them as the most powerful of their kind. The designs build on the Atlas 900, also known as the CloudMatrix 384, which uses 384 of Huawei’s Ascend 910C chips.
Research groups have noted that on certain performance measures, Huawei’s latest product surpasses Nvidia’s GB200 NVL72, which is powered by 72 B200 chips. Huawei stated that its new systems are built on a “supernode” architecture, enabling the chips to connect at very high speeds for enhanced computing power.
The move highlights Huawei’s push to strengthen China’s domestic semiconductor industry and reduce dependence on global supply chains, especially those influenced by U.S. restrictions.
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