The Kirin 9030 chip used in Huawei Technologies Mate 80 series has been manufactured by China leading semiconductor foundry SMIC using an improved 7 nanometre process, according to Canadian research firm. The firm noted that while the process shows progress, it still trails behind the more advanced chip technologies of global rivals.
The firm said the Kirin 9030 is produced using SMIC N plus 3 process. This process is described as a scaled extension of its earlier 7 nanometre N plus 2 node. The findings were published in a report dated December 8.
The research firm added that the latest process marks an incremental improvement but continues to lag behind global standards. “However, in absolute terms, N+3 remains substantially less scaled than industry 5 nanometer processes from TSMC and Samsung,” the report said.
TSMC and Samsung currently lead the global semiconductor industry with more advanced manufacturing technologies, which allow for smaller, faster, and more power efficient chips. In comparison, SMIC latest process reflects gradual progress under challenging conditions.
Huawei and SMIC did not immediately respond to requests for comment outside regular business hours.
The research firm has been publishing regular reports tracking the progress of Huawei and SMIC in semiconductor development.
The latest findings highlight both the advancements and the remaining gap in China domestic chip manufacturing efforts as it continues to build capabilities in advanced semiconductor technology.
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