China’s push to strengthen its semiconductor capabilities has received a boost as a major domestic chipmaker advances its technology for artificial intelligence chips.
Hua Hong Group, China’s 2nd-largest chipmaker, has developed advanced manufacturing technologies aimed at producing AI chips. The move is part of Beijing’s broader strategy to reduce dependence on foreign technology and build stronger domestic semiconductor capabilities.
The company’s contract chipmaking unit, Huali Microelectronics, is preparing a 7nm chipmaking process at its plant in Shanghai. With this development, Hua Hong is set to become the 2nd Chinese company after Semiconductor Manufacturing International Corporation (SMIC) to reach this level of manufacturing capability.
Collaboration with Huawei
The progress on the 7nm process has been achieved through collaboration with Chinese technology giant Huawei Technologies. The companies have been working together on advanced chip manufacturing technologies.
However, several details remain unclear. Information about how Hua Hong achieved the 7nm capability, the efficiency of the manufacturing process, and the key equipment suppliers involved in the development has not been disclosed.
Plans for initial chip production
Huali Microelectronics plans to begin initial 7nm chip production by the end of this year. The starting capacity is expected to be a few thousand wafers per month, according to a report by a news agency. The company aims to gradually expand production capacity after the initial rollout.
Chinese GPU designer Biren Technology is already using Huali’s 7nm production line for tape-out. This stage involves committing a chip design to a physical prototype so it can be tested before large-scale manufacturing begins.
Hua Hong Fab 6 facility
Hua Hong Fab 6 is currently the most advanced among the 7 foundries operated by Hua Hong Group. The facility produces logic chips using 22nm and 28nm process nodes. It plays a key role in the company’s plan to expand production capacity and keep pace with global semiconductor advancements.
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