Taiwan-based manufacturing major Foxconn has announced a partnership with US-based artificial intelligence chip designer Nvidia to jointly develop advanced AI factory infrastructure. The announcement was made during the OCP Global Summit 2025 in San Jose, California, according to a report by a common news source.
In its statement, Foxconn said it will integrate Nvidia’s 800 VDC data centre power architecture into its K-1 AI data centre project in Kaohsiung for the first time. The initiative highlights Foxconn’s growing focus on AI servers, data centres, and renewable energy solutions.
The 800 VDC power architecture is engineered to support high-density AI workloads. It features a modular, scalable design that reduces current and resistive losses, limits conductor use, simplifies power distribution, and enhances energy conversion efficiency and system safety.
According to Foxconn, this architecture will also support Nvidia’s next-generation graphics processing units (GPUs), laying a strong foundation for energy-efficient AI servers and data centres with greater power stability to meet the increasing global demand for computing resources.
Foxconn further stated that it will continue to strengthen its design expertise in AI servers, power management, and cooling technologies to deliver quick and efficient solutions for AI data centres.
“Through continuous innovation in high-efficiency power and thermal design, Foxconn reinforces its leadership and highlights Taiwan’s pivotal role in the global AI supply chain,” the company said.
At the same summit, Foxconn’s cloud solutions subsidiary, Ingrasys Technology Inc., showcased several next-generation AI platforms. These included Nvidia GB300 NVL72, Nvidia HGX B300, and Nvidia MGX servers, all designed for enterprise-level AI applications.
Foxconn added that the innovations introduced by Ingrasys reflect its strong capabilities in AI infrastructure development and system integration, further strengthening its global leadership in advanced technology manufacturing.
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