Broadcom has launched its latest networking chip, Jericho4, developed by its silicon division. The chip is designed to boost artificial intelligence computing and enable high-speed data transfers between data centers located up to 60 miles or 96.5 kilometres apart.
As AI development becomes more demanding, it requires the use of thousands of graphics processing units, or GPUs, working together. This puts increasing pressure on the underlying networks to support fast and secure data movement. Cloud service providers like Microsoft and Amazon need powerful networking chips to ensure that data flows smoothly and without delay.
Jericho4 introduces major improvements that increase the speed and volume of data traffic within and between large data centers. According to Ram Velaga, senior vice president and general manager of Broadcom’s Core Switching Group, the chips are designed for large-scale deployment. A single system can support up to 4,500 Jericho4 chips.
To handle congestion in high-traffic networks, Jericho4 uses high-bandwidth memory, or HBM. This is the same type of memory found in AI processors made by companies such as Nvidia and AMD. The memory allows the switch to temporarily hold data until congestion clears. Velaga explained, “The switch is actually holding that traffic (in memory) till the congestion frees up. It means you need to have a lot of memory on the chip.”
As the distance between the chip and the data’s destination increases, the chip requires more memory to manage the flow of information efficiently.
Security is another key focus of Jericho4. The chip encrypts data being transmitted, offering protection from potential cyberattacks during transfers outside the physical boundaries of a data center.
To manufacture the chip, Broadcom has chosen Taiwan Semiconductor Manufacturing Company’s three nanometre process technology, which offers improved efficiency and performance.
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