Bourns has expanded its global innovation network with the launch of its first design centre in India. The new facility in Bangalore gives engineers and developers local access to tools, support and reference designs that use the company’s high performance components.
The centre aims to strengthen innovation by offering an extensive library of reference designs and technical resources. These resources help developers test ideas, improve application performance and build stronger differentiation for their products. The facility also provides direct access to experienced engineers who can guide customers through technical challenges.
The company says the centre is designed to improve development cycles. It offers established processes that allow quick prototyping and efficient validation. It also promotes close collaboration among engineering, product management and marketing teams. Customers will be able to see the impact of their design decisions and receive hands on support through co design sessions and training programs.
Bourns chose Bangalore for the design centre because of the region’s strong engineering talent. The new eight thousand square foot facility was inaugurated on November 13 at an event attended by business partners and customers.
Gordon Bourns, Chairman and CEO at Bourns, Inc. said, “Bourns continues to be at the forefront of engineering innovative power, protection and sensing solutions that help advance the development of efficient and sustainable applications. The opening of this centre aligns with Bourns’ global focus on high-growth market segments, and reaffirms our commitment to responsible environmental management by influencing low carbon designs.”
Al Yost, President and COO at Bourns said, “By opening this new collaborative design centre, we are adding essential capabilities to address complex design challenges enabling our customers to streamline and simplify application development. Developers will reap the advantages of Bourns’ proven magnetic component design expertise that will empower them to meet next-generation IC performance, shorten design cycles and add industry-leading features to their end products.”
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