Thursday, June 26, 2025

Top 5 This Week

Related News

Bosch BGSW and Mindgrove Technologies Ink MoU to Explore Semiconductor Synergies

Bosch Global Software Technologies Private Limited (BGSW) has announced the signing of a Memorandum of Understanding (MoU) with Mindgrove Technologies, a Chennai-based fabless semiconductor company. This strategic partnership aims to unlock new avenues for collaboration and drive innovation within the semiconductor and broader technology sectors.

The core objective of this MoU is to explore joint go-to-market opportunities. This will involve the integration of BGSW’s and Mindgrove’s respective products, services, and solutions to cater to a wider base of potential customers, leveraging their combined strengths.

Under the terms of the agreement, BGSW will adopt Mindgrove’s advanced Systems-on-Chip (SoCs) for its internal operations. Furthermore, BGSW plans to recommend Mindgrove’s SoCs to its partners across a diverse range of domains. These sectors include critical areas such as industrial automation, consumer electronics, automotive systems, and smart IoT (Internet of Things) infrastructure.

The partnership also outlines a clear path for future collaboration. Once Mindgrove’s products are ready for commercialization, both organizations intend to formalize their collaboration through a long-term agreement. This future agreement will focus on the large-scale deployment of these integrated solutions in targeted applications, signifying a deeper commitment to bringing innovative semiconductor-driven solutions to market.

“Through this partnership, we bring together Bosch’s industry-leading R&D expertise and Mindgrove’s capabilities in designing high-performance, cost-efficient chips tailored for Indian and global markets to enable the future of smart, secure, and efficient electronic systems,” Yashwanth Singh M, Firmware & Silicon Architect at Bosch Global Software Technologies. “We’re happy to join hands with an indigenous chip design partner whose innovation roadmap aligns with real-world industrial needs in the country,” he further adds.

“This collaboration represents a significant step in building more innovation-driven products that require the right SoC platforms to deliver efficient and actionable outcomes,” said Shashwath TR, Co-founder & CEO of Mindgrove Technologies. “By infusing our chip design capabilities with Bosch’s proven engineering experience, we aim to catalyse the deployment of high-impact solutions across critical domains,” he adds.

Also read: Viksit Workforce for a Viksit Bharat

Do Follow: The Mainstream formerly known as CIO News LinkedIn Account | The Mainstream formerly known as CIO News Facebook | The Mainstream formerly known as CIO News Youtube | The Mainstream formerly known as CIO News Twitter |The Mainstream formerly known as CIO News Whatsapp Channel | The Mainstream formerly known as CIO News Instagram

About us:

The Mainstream formerly known as CIO News is a premier platform dedicated to delivering latest news, updates, and insights from the tech industry. With its strong foundation of intellectual property and thought leadership, the platform is well-positioned to stay ahead of the curve and lead conversations about how technology shapes our world. From its early days as CIO News to its rebranding as The Mainstream on November 28, 2024, it has been expanding its global reach, targeting key markets in the Middle East & Africa, ASEAN, the USA, and the UK. The Mainstream is a vision to put technology at the center of every conversation, inspiring professionals and organizations to embrace the future of tech.

Popular Articles